Please use this identifier to cite or link to this item: https://ah.nccu.edu.tw/handle/140.119/126270


Title: Patent Litigation Precaution Method- Analyzing Characteristics of US Litigated and Non-litigated Patents from 1976 to 2010
Authors: 李沛錞
Lee, Pei-Chun
Su, Hsin-Ning
Chen, Carey Ming-Li
Contributors: 圖檔所
Keywords: Patent characteristics;Patent litigation;Precaution Logistic model
Date: 2012-07
Issue Date: 2019-09-19 09:49:37 (UTC+8)
Abstract: This study aims to propose an early precaution method which allows predicting probability of patent infringement as well as evaluating patent value. To obtain the purposes, a large-scale analysis on both litigated patents and non-litigated patents issued between 1976 and 2010 by USPTO are conducted. The holistic scale analysis on the two types of patents (3,878,852 non-litigated patents and 31,992 litigated patents in total) issued by USPTO from 1976 to 2010 has not been conducted in literatures and need to be investigated to allow patent researchers to understand the overall picture of the USPTO patents. Also, by comparing characteristics of all litigated patents to that of non-litigated patents, a precaution method for patent litigation can be obtained. Both litigated patents and non-litigated patents are analyzed to understand the differences between the two types of patents in terms of different variables. It is found that there are statistically significant differences for the two types of patents in the following 11 variables: (1) No. of Assignee, (2) No. of Assignee Country, (3) No. of Inventor, (4) Inventor Country, (5) No. of Patent Reference, (6) No. of Patent Citation Received, (7) No. of IPC, (8) No. of UPC, (9) No. of Claim, (10) No. of Non-Patent Reference, and (11) No. of Foreign Reference. Finally, logistic regression is used for predicting the probability of occurrence of a patent litigation by fitting the 11 characteristics of 3,910,844 USPTO patents to a logistic function curve
Relation: Scientometrics, Vol.92, No.1, pp.181–195
Data Type: article
DOI 連結: https://doi.org/10.1007/s11192-012-0716-7
Appears in Collections:[圖書資訊與檔案學研究所] 期刊論文

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