異質整合製程技術專利分析

Abstract

半導體充斥現今生活，不論是手機、電視或是汽車，各種應用都需要半導體，新型態的應用和對高效能的追求，必須透過不斷進步的製程技術因應，然而先進製程開發不易且成本高昂，過往遵循摩爾定律發展的電晶體密度提升速度趨緩，異質整合成為眾所期待的解方之一，透過異質整合可以在相同電晶體密度的情況下，達到訊號傳遞更快速、耗能更低的優勢。然而異質整合的範疇廣泛，不同的應用功能需要整合的元件也大不相同，所需的技術也有所不同，因此本文透過專利分析試圖找出重要的技術方向和現今的技術發展狀態，希望透過分析結果指出企業可能的發展方向。

Semiconductor devices are everywhere in our life, Like mobile phones, TVs or automobiles. New applications and the pursuit of high performance must be responded by continuously improved manufacturing technology. In the past, the density of transistors trends up with Moore’s law. However, advanced process node development is difficult and costly. Heterogeneous integration has become one of the solutions that everyone is looking forward to. With the benefit of Heterogeneous Integration, it is possible to achieve faster signal transmission and lower energy consumption under the same transistor density. However, the scope of Heterogeneous Integration is wide, the components that need to be integrated for different application functions are also very different, and the required technologies are also different. Therefore, to find important technical fields and to realize the status of technology development through patent analysis is the goal of this essay. Hope the analysis points out the possible development direction for the enterprise.