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題名 欣興低功率處理器市場發展策略之研究
Growing strategies of uni-micron through CULV CPU products
作者 杜慧雯
Tu, Amber
貢獻者 康榮寶
Kang, Jungpao
杜慧雯
Tu, Amber
關鍵詞 發展策略
日期 2008
上傳時間 14-Sep-2009 09:51:13 (UTC+8)
摘要 欣興低功率處理器市場發展策略之研究
Printed circuit boards, being one of the most important components in electronics systems as
     it is widely used in a variety of modern electronic end-products including mobile phones, PCs,
     TFT-LCD TVs, consumer electronics, and automobiles. Although the respective industry
     revenue contracted by nearly 20% in 2001 as a result of “Tech Bubble”, its revenue soon
     resumed to grow 5% and 22% in 2003 and 2004 respectively. In 2008, the PCB market value
     has grown from US$33.1 billion in 2003 to an estimated worth of US$48 billion, in line with
     the growth of the global electronic market which had increased from US$893 billion to
     US$1,389 billion.
     Unimicron Technology Corporation was founded in 1990 and publicly listed on Taiwan OTC
     in 1998. As of Mar, 31st, 2009, its consolidated net worth stood at TWD 28.5bn (USD876mn).
     Market capitalization amounted to TWD21.3bn (USD0.65bn), based on a closing price of
     TWD43.6 per share as of Mar, 31st, 2009. In terms of total sales amount, Unimicron is the
     largest PCB producer in Taiwan. On a global basis, it ranks No.2 next to Ibiden (Japan). In
     terms of product, Unimicron is the largest producer of handset PCB in Taiwan, followed by
     Compeq. The company has successively increased its global market share of handset PCB
     from 9% in 2003 to 20% in 2007, and 25% in 2008 through aggressive expansion and
     technology upgrade.
     With Unmicron’s current technology advantages and leading position in High Density
     Interconnects and Chip Scale Package as well as Phoenix Precision Technology’s strong
     knowledge in Flip Chip, it is expected that new Unimicron could without a doubt penetrate
     into PC and Smartphone segments through the consumer ultra-low voltage (CULV) platform.
Chapter 1: PCB Industry Overview...........................................................................1
     1.1. PCB in IT Industry .....................................................................................................1
     1.1.1. Trend of Global PCB Industry: Market Size ....................................................2
     1.1.2. Geographic Breakdown ....................................................................................2
     1.2. PCB Supply Chain: Major Players, Products & Characteristics ................................3
     1.2.1. Upstream: Material Suppliers and CCL Manufacturers ...................................3
     1.2.2. Mid-Stream PCB Vendors ................................................................................4
     1.2.2.1. Conventional PCB ..............................................................................5
     1.2.2.2. High Density Interconnects (HDI) PCB.............................................6
     1.2.2.3. IC substrates .......................................................................................6
     1.2.2.4. Cost Structure Among Segments........................................................8
     1.2.3. Down-Stream: End-Product Applications ........................................................8
     1.3. Key Success Factors .................................................................................................10
     1.4. Environmental Concerns ..........................................................................................11
     Chapter 2: Case Study: Unimicron...........................................................................12
     2.1. Overview on Unimicrom ..........................................................................................12
     2.1.2. Business Strategy............................................................................................14
     2.1.3. Financial performance ....................................................................................15
     2.1.4. Latest Developments ......................................................................................18
     2.2. Peer Comparison: Major players & Unimicron’s Market Position ..........................21
     Chapter 3: Developments & Trends in IT Industry..................................................28
     3.1. Trends in Global PC Market.....................................................................................28
     3.1.1. Battles Between Notebook and Desktop ........................................................28
     3.1.2. New NB Segmentation: Netbook. ..................................................................29
     3.2. Developments of CULV Processors .........................................................................29
     3.3. Implication of Cooperation between Intel and Nokia: Smart Phone........................31
     Chapter 4: PCB Segment Movement ......................................................................33
     4.1. Reallocation of the Market Shares among PCB Segments.......................................33
     Chapter 5: Conclusion..............................................................................................35
     5.1. Unimicron’s Growth Opportunity and Strategy .......................................................35
     Reference..................................................................................................................38
     Appendix..................................................................................................................40
參考文獻 1. Leping Huang and Anne Lee, " Printed Circuit Boards | ASIA PACIFIC," Nomura
Securities Co Ltd Anchor Report, 24 Apr., p. 1-45, 2009.
2. Agam Shah, “The new Atom platform will move the chipset alongside the Atom
processor in a single chip,” IDG News Service, 29 May., p. 1, 2009.
3. Robert Cheng, Pauline Chen, Darryl Cheng, Jessica Chang, and Jill Su, " Asia PC
Sector," Credit Suisse Asia Pacific Equity Research, 21 Apr., p. 1-45, 2009.
4. Henry King and Kevin Lu, " Taiwan: Technology: Hardware," Goldman Sachs (Asia)
L.L.C., Global Investment Research, 25 Mar., p. 1-5, 2009.
5. Tse-yong Yao and Steven Pelayo, "PCB Survivors: looking for downturn resiliency,"
HSBC Global Research, 02 Dec., p. 4-18, 2008.
6. Edward Yen and Arthur Hsieh, “Unimicron,” UBS Global Equity Research, 20 Mar.,
p.1-3, 2009.
7. Anya Chang, Sharon Shih and Jasmine Lu, “Taiwan IC Substrates: Read on
Unimicron/PPT Merger,” Morgan Stanley Research Asia/Pacific, 23 Mar., p. 1-3, 2009.
8. Vincent Chen, “Unimicron, Taiwan: PCB/Substrates,” Yuanta Security Equity Research,
23 Mar., p.1-2, 2009.
9. Bonny Weng, “Unimicron Technology,” KGI Asia Equity Research, 26 Mar., p. 1-5,
2009.
10. James Chiu, William Chen and Daniel Chang, “Unimicron,” Macquarie Research
Equities, 08 May., p.1-2, 2009.
11. Anya Chang, Sharon Shih and Jasmine Lu, “Unimicron Merger Concern Resurfacing
After AGM Approval,” Morgan Stanley Research Asia/Pacific, 10 Jun., p. 1-2, 2009.
12. Grace Chen, Sharon Shih and Jasmine Lu, “Taiwan PC & Handsets: Monthly Databook,”
Morgan Stanley Research Asia/Pacific, 15 Oct., p. 3-12, 2008.
13. James Chiu, William Chen and Daniel Chang, “PCB sector,” Macquarie Research
Equities, 14 Apr., p.1-13, 2009.
14. Dennis Wang and Allen Pu, “ Taiwan PCB industry update,” Fubon Equity Research, 15
Apr., p.1-5, 2009.
15. CK Cheng, “Taiwan PCB Sector outlook,” CLSA Asia-Pacific Markets, 08 May., P 1-7,
2009.
16. 楊喻斐，「08年全球PCB廠排行，欣興 南電 健鼎居前十大」，精實新聞，民國98年
5月13日，頁I-II。
17. 劉思良，「個股報告，台燿電子」，元大投顧，民國97年6月2日，頁III。
18. 「IC載板產業」，元富投顧，民國97年12月10日，頁I –VIII。
描述 碩士
國立政治大學
國際經營管理碩士班(IMBA)
96933009
97
資料來源 http://thesis.lib.nccu.edu.tw/record/#G0096933009
資料類型 thesis
dc.contributor.advisor 康榮寶zh_TW
dc.contributor.advisor Kang, Jungpaoen_US
dc.contributor.author (Authors) 杜慧雯zh_TW
dc.contributor.author (Authors) Tu, Amberen_US
dc.creator (作者) 杜慧雯zh_TW
dc.creator (作者) Tu, Amberen_US
dc.date (日期) 2008en_US
dc.date.accessioned 14-Sep-2009 09:51:13 (UTC+8)-
dc.date.available 14-Sep-2009 09:51:13 (UTC+8)-
dc.date.issued (上傳時間) 14-Sep-2009 09:51:13 (UTC+8)-
dc.identifier (Other Identifiers) G0096933009en_US
dc.identifier.uri (URI) https://nccur.lib.nccu.edu.tw/handle/140.119/31356-
dc.description (描述) 碩士zh_TW
dc.description (描述) 國立政治大學zh_TW
dc.description (描述) 國際經營管理碩士班(IMBA)zh_TW
dc.description (描述) 96933009zh_TW
dc.description (描述) 97zh_TW
dc.description.abstract (摘要) 欣興低功率處理器市場發展策略之研究zh_TW
dc.description.abstract (摘要) Printed circuit boards, being one of the most important components in electronics systems as
     it is widely used in a variety of modern electronic end-products including mobile phones, PCs,
     TFT-LCD TVs, consumer electronics, and automobiles. Although the respective industry
     revenue contracted by nearly 20% in 2001 as a result of “Tech Bubble”, its revenue soon
     resumed to grow 5% and 22% in 2003 and 2004 respectively. In 2008, the PCB market value
     has grown from US$33.1 billion in 2003 to an estimated worth of US$48 billion, in line with
     the growth of the global electronic market which had increased from US$893 billion to
     US$1,389 billion.
     Unimicron Technology Corporation was founded in 1990 and publicly listed on Taiwan OTC
     in 1998. As of Mar, 31st, 2009, its consolidated net worth stood at TWD 28.5bn (USD876mn).
     Market capitalization amounted to TWD21.3bn (USD0.65bn), based on a closing price of
     TWD43.6 per share as of Mar, 31st, 2009. In terms of total sales amount, Unimicron is the
     largest PCB producer in Taiwan. On a global basis, it ranks No.2 next to Ibiden (Japan). In
     terms of product, Unimicron is the largest producer of handset PCB in Taiwan, followed by
     Compeq. The company has successively increased its global market share of handset PCB
     from 9% in 2003 to 20% in 2007, and 25% in 2008 through aggressive expansion and
     technology upgrade.
     With Unmicron’s current technology advantages and leading position in High Density
     Interconnects and Chip Scale Package as well as Phoenix Precision Technology’s strong
     knowledge in Flip Chip, it is expected that new Unimicron could without a doubt penetrate
     into PC and Smartphone segments through the consumer ultra-low voltage (CULV) platform.		en_US
dc.description.abstract (摘要) Chapter 1: PCB Industry Overview...........................................................................1
     1.1. PCB in IT Industry .....................................................................................................1
     1.1.1. Trend of Global PCB Industry: Market Size ....................................................2
     1.1.2. Geographic Breakdown ....................................................................................2
     1.2. PCB Supply Chain: Major Players, Products & Characteristics ................................3
     1.2.1. Upstream: Material Suppliers and CCL Manufacturers ...................................3
     1.2.2. Mid-Stream PCB Vendors ................................................................................4
     1.2.2.1. Conventional PCB ..............................................................................5
     1.2.2.2. High Density Interconnects (HDI) PCB.............................................6
     1.2.2.3. IC substrates .......................................................................................6
     1.2.2.4. Cost Structure Among Segments........................................................8
     1.2.3. Down-Stream: End-Product Applications ........................................................8
     1.3. Key Success Factors .................................................................................................10
     1.4. Environmental Concerns ..........................................................................................11
     Chapter 2: Case Study: Unimicron...........................................................................12
     2.1. Overview on Unimicrom ..........................................................................................12
     2.1.2. Business Strategy............................................................................................14
     2.1.3. Financial performance ....................................................................................15
     2.1.4. Latest Developments ......................................................................................18
     2.2. Peer Comparison: Major players & Unimicron’s Market Position ..........................21
     Chapter 3: Developments & Trends in IT Industry..................................................28
     3.1. Trends in Global PC Market.....................................................................................28
     3.1.1. Battles Between Notebook and Desktop ........................................................28
     3.1.2. New NB Segmentation: Netbook. ..................................................................29
     3.2. Developments of CULV Processors .........................................................................29
     3.3. Implication of Cooperation between Intel and Nokia: Smart Phone........................31
     Chapter 4: PCB Segment Movement ......................................................................33
     4.1. Reallocation of the Market Shares among PCB Segments.......................................33
     Chapter 5: Conclusion..............................................................................................35
     5.1. Unimicron’s Growth Opportunity and Strategy .......................................................35
     Reference..................................................................................................................38
     Appendix..................................................................................................................40		-
dc.description.tableofcontents Chapter 1: PCB Industry Overview...........................................................................1
     1.1. PCB in IT Industry .....................................................................................................1
     1.1.1. Trend of Global PCB Industry: Market Size ....................................................2
     1.1.2. Geographic Breakdown ....................................................................................2
     1.2. PCB Supply Chain: Major Players, Products & Characteristics ................................3
     1.2.1. Upstream: Material Suppliers and CCL Manufacturers ...................................3
     1.2.2. Mid-Stream PCB Vendors ................................................................................4
     1.2.2.1. Conventional PCB ..............................................................................5
     1.2.2.2. High Density Interconnects (HDI) PCB.............................................6
     1.2.2.3. IC substrates .......................................................................................6
     1.2.2.4. Cost Structure Among Segments........................................................8
     1.2.3. Down-Stream: End-Product Applications ........................................................8
     1.3. Key Success Factors .................................................................................................10
     1.4. Environmental Concerns ..........................................................................................11
     Chapter 2: Case Study: Unimicron...........................................................................12
     2.1. Overview on Unimicrom ..........................................................................................12
     2.1.2. Business Strategy............................................................................................14
     2.1.3. Financial performance ....................................................................................15
     2.1.4. Latest Developments ......................................................................................18
     2.2. Peer Comparison: Major players & Unimicron’s Market Position ..........................21
     Chapter 3: Developments & Trends in IT Industry..................................................28
     3.1. Trends in Global PC Market.....................................................................................28
     3.1.1. Battles Between Notebook and Desktop ........................................................28
     3.1.2. New NB Segmentation: Netbook. ..................................................................29
     3.2. Developments of CULV Processors .........................................................................29
     3.3. Implication of Cooperation between Intel and Nokia: Smart Phone........................31
     Chapter 4: PCB Segment Movement ......................................................................33
     4.1. Reallocation of the Market Shares among PCB Segments.......................................33
     Chapter 5: Conclusion..............................................................................................35
     5.1. Unimicron’s Growth Opportunity and Strategy .......................................................35
     Reference..................................................................................................................38
     Appendix..................................................................................................................40		zh_TW
dc.language.iso en_US-
dc.source.uri (資料來源) http://thesis.lib.nccu.edu.tw/record/#G0096933009en_US
dc.subject (關鍵詞) 發展策略zh_TW
dc.title (題名) 欣興低功率處理器市場發展策略之研究zh_TW
dc.title (題名) Growing strategies of uni-micron through CULV CPU productsen_US
dc.type (資料類型) thesisen
dc.relation.reference (參考文獻) 1. Leping Huang and Anne Lee, " Printed Circuit Boards | ASIA PACIFIC," Nomurazh_TW
dc.relation.reference (參考文獻) Securities Co Ltd Anchor Report, 24 Apr., p. 1-45, 2009.zh_TW
dc.relation.reference (參考文獻) 2. Agam Shah, “The new Atom platform will move the chipset alongside the Atomzh_TW
dc.relation.reference (參考文獻) processor in a single chip,” IDG News Service, 29 May., p. 1, 2009.zh_TW
dc.relation.reference (參考文獻) 3. Robert Cheng, Pauline Chen, Darryl Cheng, Jessica Chang, and Jill Su, " Asia PCzh_TW
dc.relation.reference (參考文獻) Sector," Credit Suisse Asia Pacific Equity Research, 21 Apr., p. 1-45, 2009.zh_TW
dc.relation.reference (參考文獻) 4. Henry King and Kevin Lu, " Taiwan: Technology: Hardware," Goldman Sachs (Asia)zh_TW
dc.relation.reference (參考文獻) L.L.C., Global Investment Research, 25 Mar., p. 1-5, 2009.zh_TW
dc.relation.reference (參考文獻) 5. Tse-yong Yao and Steven Pelayo, "PCB Survivors: looking for downturn resiliency,"zh_TW
dc.relation.reference (參考文獻) HSBC Global Research, 02 Dec., p. 4-18, 2008.zh_TW
dc.relation.reference (參考文獻) 6. Edward Yen and Arthur Hsieh, “Unimicron,” UBS Global Equity Research, 20 Mar.,zh_TW
dc.relation.reference (參考文獻) p.1-3, 2009.zh_TW
dc.relation.reference (參考文獻) 7. Anya Chang, Sharon Shih and Jasmine Lu, “Taiwan IC Substrates: Read onzh_TW
dc.relation.reference (參考文獻) Unimicron/PPT Merger,” Morgan Stanley Research Asia/Pacific, 23 Mar., p. 1-3, 2009.zh_TW
dc.relation.reference (參考文獻) 8. Vincent Chen, “Unimicron, Taiwan: PCB/Substrates,” Yuanta Security Equity Research,zh_TW
dc.relation.reference (參考文獻) 23 Mar., p.1-2, 2009.zh_TW
dc.relation.reference (參考文獻) 9. Bonny Weng, “Unimicron Technology,” KGI Asia Equity Research, 26 Mar., p. 1-5,zh_TW
dc.relation.reference (參考文獻) 2009.zh_TW
dc.relation.reference (參考文獻) 10. James Chiu, William Chen and Daniel Chang, “Unimicron,” Macquarie Researchzh_TW
dc.relation.reference (參考文獻) Equities, 08 May., p.1-2, 2009.zh_TW
dc.relation.reference (參考文獻) 11. Anya Chang, Sharon Shih and Jasmine Lu, “Unimicron Merger Concern Resurfacingzh_TW
dc.relation.reference (參考文獻) After AGM Approval,” Morgan Stanley Research Asia/Pacific, 10 Jun., p. 1-2, 2009.zh_TW
dc.relation.reference (參考文獻) 12. Grace Chen, Sharon Shih and Jasmine Lu, “Taiwan PC & Handsets: Monthly Databook,”zh_TW
dc.relation.reference (參考文獻) Morgan Stanley Research Asia/Pacific, 15 Oct., p. 3-12, 2008.zh_TW
dc.relation.reference (參考文獻) 13. James Chiu, William Chen and Daniel Chang, “PCB sector,” Macquarie Researchzh_TW
dc.relation.reference (參考文獻) Equities, 14 Apr., p.1-13, 2009.zh_TW
dc.relation.reference (參考文獻) 14. Dennis Wang and Allen Pu, “ Taiwan PCB industry update,” Fubon Equity Research, 15zh_TW
dc.relation.reference (參考文獻) Apr., p.1-5, 2009.zh_TW
dc.relation.reference (參考文獻) 15. CK Cheng, “Taiwan PCB Sector outlook,” CLSA Asia-Pacific Markets, 08 May., P 1-7,zh_TW
dc.relation.reference (參考文獻) 2009.zh_TW
dc.relation.reference (參考文獻) 16. 楊喻斐，「08年全球PCB廠排行，欣興 南電 健鼎居前十大」，精實新聞，民國98年zh_TW
dc.relation.reference (參考文獻) 5月13日，頁I-II。zh_TW
dc.relation.reference (參考文獻) 17. 劉思良，「個股報告，台燿電子」，元大投顧，民國97年6月2日，頁III。zh_TW
dc.relation.reference (參考文獻) 18. 「IC載板產業」，元富投顧，民國97年12月10日，頁I –VIII。zh_TW