1. NCCU Academic Hub
  2. 學術產出
  3. College of Social Science
  4. Periodical Articles
  5. Item

學術產出-Periodical Articles

Article View/Open

Publication Export

Google ScholarTM

政大圖書館

Citation Infomation

題名 International R&D funding and patent collateral in an R&D-based growth model
作者 Huang, Wei-Chi;Lai, Ching-Chong;Chen, Ping-Ho
賴景昌
Lai, Ching-Chong
貢獻者 經濟系
關鍵詞 International R&D funding; Patent collateral; R&D-based growth model; Optimal patent protection
日期 2017-09
上傳時間 22-Dec-2018 11:58:58 (UTC+8)
摘要 This paper develops an R&D-based growth model featuring international R&D funding and patent collateral. Several main findings emerge from the analysis. First, with an inelastic labor supply, a rise in the fraction of patent collateral is beneficial to both innovations and economic growth. Second, when labor supply is inelastic, a rise in either the foreign interest rate or the fraction of borrowed R&D funding is harmful to innovations and economic growth. Third, our numerical results show that the above two findings are robust when labor is supplied elastically. Finally, our numerical results indicate that, regardless of whether labor supply is inelastic or elastic, the government can implement an optimal patent breadth policy to maximize the social welfare level. Our numerical results also point out that this optimal patent breadth will decrease in response to a reduction in the foreign interest rate, a rise in the fraction of the collateral, and a reduction in the fraction of borrowed R&D labor costs.
關聯 INTERNATIONAL REVIEW OF ECONOMICS & FINANCE, 51, 545-561
資料類型 article
DOI http://dx.doi.org/10.1016/j.iref.2017.07.009
dc.contributor 經濟系
dc.creator (作者) Huang, Wei-Chi;Lai, Ching-Chong;Chen, Ping-Ho
dc.creator (作者) 賴景昌
dc.creator (作者) Lai, Ching-Chong
dc.date (日期) 2017-09
dc.date.accessioned 22-Dec-2018 11:58:58 (UTC+8)-
dc.date.available 22-Dec-2018 11:58:58 (UTC+8)-
dc.date.issued (上傳時間) 22-Dec-2018 11:58:58 (UTC+8)-
dc.identifier.uri (URI) http://nccur.lib.nccu.edu.tw/handle/140.119/121479-
dc.description.abstract (摘要) This paper develops an R&D-based growth model featuring international R&D funding and patent collateral. Several main findings emerge from the analysis. First, with an inelastic labor supply, a rise in the fraction of patent collateral is beneficial to both innovations and economic growth. Second, when labor supply is inelastic, a rise in either the foreign interest rate or the fraction of borrowed R&D funding is harmful to innovations and economic growth. Third, our numerical results show that the above two findings are robust when labor is supplied elastically. Finally, our numerical results indicate that, regardless of whether labor supply is inelastic or elastic, the government can implement an optimal patent breadth policy to maximize the social welfare level. Our numerical results also point out that this optimal patent breadth will decrease in response to a reduction in the foreign interest rate, a rise in the fraction of the collateral, and a reduction in the fraction of borrowed R&D labor costs.en_US
dc.format.extent 585529 bytes-
dc.format.mimetype application/pdf-
dc.relation (關聯) INTERNATIONAL REVIEW OF ECONOMICS & FINANCE, 51, 545-561
dc.subject (關鍵詞) International R&D funding; Patent collateral; R&D-based growth model; Optimal patent protectionen_US
dc.title (題名) International R&D funding and patent collateral in an R&D-based growth modelen_US
dc.type (資料類型) article
dc.identifier.doi (DOI) 10.1016/j.iref.2017.07.009
dc.doi.uri (DOI) http://dx.doi.org/10.1016/j.iref.2017.07.009