dc.contributor | 圖檔所 | |
dc.creator (作者) | 李沛錞 | |
dc.creator (作者) | Lee, Pei-Chun | |
dc.creator (作者) | Chen, Ssu-Hua | |
dc.creator (作者) | Lin, Yi-Siang | |
dc.creator (作者) | Su, Hsin-Ning | |
dc.date (日期) | 2018-06 | |
dc.date.accessioned | 19-Sep-2019 09:50:35 (UTC+8) | - |
dc.date.available | 19-Sep-2019 09:50:35 (UTC+8) | - |
dc.date.issued (上傳時間) | 19-Sep-2019 09:50:35 (UTC+8) | - |
dc.identifier.uri (URI) | http://nccur.lib.nccu.edu.tw/handle/140.119/126289 | - |
dc.description.abstract (摘要) | Environmental change and unexpected crises are major threats to industrial development. Industries must build technological resilience to reduce the impact of shocks. Resilience has become a crucial concept for addressing vulnerabilities and developing flexible methods of adapting to crises. This study examined the concept of technological resilience, particularly at the industry level, as well as the factors that may influence technological resilience. Moreover, the relative capability of industries to maintain their production of technological knowledge during disruptive events was examined by analyzing the growth and crises of patenting. This methodology yielded novel insights into technological resilience with multidimensional perspectives. Collaboration reinforces technological resilience by reducing crisis probability and intensity. In addition, high-quality and diversified technological knowledge enhances technological resilience by reducing the probability, intensity, or duration of crises. | |
dc.format.extent | 2004563 bytes | - |
dc.format.mimetype | application/pdf | - |
dc.relation (關聯) | IEEE Transactions on Engineering Management, Vol.99, No.1, pp.1-14 | |
dc.subject (關鍵詞) | Industrial resilience ; industrial innovation ; patent ; technological crisis ; technological resilience | |
dc.title (題名) | Toward a Better Understanding on Technological Resilience for Sustaining Industrial Development | |
dc.type (資料類型) | article | |
dc.identifier.doi (DOI) | 10.1109/TEM.2018.2837221 | |
dc.doi.uri (DOI) | https://doi.org/10.1109/TEM.2018.2837221 | |