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題名 台韓半導體先進封裝之銷售與技術策略規劃研究
The Sales and Technology Strategy of Advanced Semiconductor Packaging in Taiwan and South Korea
作者 吳明倫
Wu, Ming-Lun
貢獻者 黃家齊
吳明倫
Wu, Ming-Lun
關鍵詞 半導體
先進封裝
銷售策略
技術策略
台韓比較
Semiconductor
Advanced Packaging
Sales Strategy
Technology Strategy
Taiwan–Korea Comparison
日期 2025
上傳時間 4-Aug-2025 13:00:46 (UTC+8)
摘要 本研究旨在深入探討台灣與韓國在半導體先進封裝領域的銷售與技術策略。在全球半導體產業競爭日益激烈的背景下，先進封裝技術已成為提升晶片效能、降低功耗、縮小尺寸的關鍵。本研究針對台積電、日月光、三星、Amkor等領先企業進行分析，探討其銷售模式、市場策略、技術發展與全球佈局上的差異，進一步比較台韓企業在客戶群、定價策略與供應鏈管理的異同。 研究發現，台灣企業以專業代工與供應鏈整合能力見長，特別在CoWoS與SoIC平台已具備成熟商業模式；韓國企業則仰賴IDM垂直整合與政府政策支持，強化記憶體與系統級整合的競爭力。在高效能運算與AI應用領域，台積電憑藉先進封裝能力居於領先地位，而三星尚處於技術追趕階段。日月光與Amkor分別為台韓封測生態的代表，展現不同的市場定位與服務強項。 本研究也指出，先進封裝發展促使晶圓代工與封測廠由傳統分工轉向策略競合，尤其以台積電與Amkor於美國亞利桑那州的合作為代表案例，反映產業結構與商業模式正在調整。此外，台韓企業未來的全球市場定位，將取決於其是否能靈活運用技術創新、客戶整合、在地化生產與國際策略聯盟等多元策略。 研究採用次級資料分析方法，蒐集市場調查報告、產業分析、企業財報等資訊，並輔以作者所屬公司與台積電、日月光、三星、Amkor等企業於先進封裝領域的實務合作經驗，以掌握產業第一手觀察，補強公開資料的不足。 研究範圍涵蓋Fan-out、2.5D、3D IC等先進封裝技術，並從銷售策略與技術策略兩大主軸切入，結合SWOT分析架構，全面評估台韓在先進封裝領域的優勢與挑戰。最終，提出企業應強化研發投入、供應鏈彈性、人才培育與跨國合作的建議；政府層面運用鑽石模型（Diamond Model）切入，應推動基礎設施建設、政策補助與智慧財產保護，以厚植競爭韌性並鞏固國際地位。 本研究不僅為學術界提供一套深入理解台韓半導體封裝策略的研究基礎，亦為企業與政策制定者提供實務參考，以應對全球半導體供應鏈重組與技術演進所帶來的多重挑戰。
This study aims to explore the sales and technology strategies of Taiwan and South Korea in the field of advanced semiconductor packaging. Amid intensifying global semiconductor competition, advanced packaging technologies have become critical for enhancing chip performance, reducing power consumption, and minimizing device size. This research analyzes leading companies including TSMC, ASE, Samsung, and Amkor, examining differences in their sales models, market strategies, technology development approaches, and global deployment. It also compares the two countries’ approaches in customer targeting, pricing, and supply chain management. Findings indicate that Taiwanese companies excel in specialized foundry services and supply chain integration, with mature commercialization platforms such as CoWoS and SoIC. In contrast, Korean firms leverage IDM vertical integration and strong government policy support to strengthen their competitiveness in memory and system-level integration. In high-performance computing and AI applications, TSMC leads with advanced packaging capabilities, while Samsung remains in a catch-up phase. ASE and Amkor represent the respective packaging ecosystems in Taiwan and Korea, each with differentiated market positioning and service strengths. The study also observes a growing trend of competition-collaboration (coopetition) between foundries and OSATs in advanced packaging, as seen in the strategic partnership between TSMC and Amkor in Arizona, USA. The evolution from traditional division of labor to collaborative innovation reflects a shift in industry structure and business models. Furthermore, future global market positioning of Taiwan and Korea will depend on their ability to flexibly leverage strategies such as technological innovation, customer integration, localization, and international alliances. A secondary data analysis approach was adopted, utilizing market research reports, industry analyses, and financial statements, complemented by the author’s firsthand experience from business collaborations with TSMC, ASE, Samsung, and Amkor in advanced packaging. This combination provided deeper industry insights beyond what is available from public information. The research focuses on key advanced packaging technologies including fan-out, 2.5D, and 3D IC. It evaluates the strengths and challenges of Taiwanese and Korean enterprises using SWOT analysis across two strategic dimensions: sales and technology. The study concludes with comprehensive recommendations—companies should enhance R&D investments, improve supply chain resilience, nurture talent, and foster cross-border collaboration; while governments should strengthen infrastructure, provide financial incentives, and reinforce intellectual property protection to bolster global competitiveness. This study contributes to academic understanding of the strategic development in Taiwan and South Korea’s advanced packaging sectors and offers practical insights for businesses and policymakers to respond to emerging challenges in the evolving global semiconductor landscape.
參考文獻 1. Bish, J., Stewart, D., Ramachandran, K., Lee, P., & Beerlage, S. (2022). A new dawn for European chips. https://www2.deloitte.com/us/en/insights/industry/technology/semiconductor-chip-shortage-supply-chain.html 2. Byun, B.-M., & Ahn, B. (1989). Growth of the Korean semiconductor industry and its competitive strategy in the world market. Technovation, 9(8), 635. https://doi.org/10.1016/0166-4972(89)90004-7 3. Chai, T., Ho, D., Chong, S., Hsiao, H., Soh, S., Lim, S., PS, S. L., Wai, E. L. C., BL, L., WW, S., Gk, L., TS, P., Lim, K. C. S., SH, S. L., & Yl, Y. (2020). Fan-Out Wafer Level Packaging Development Line. 440. https://doi.org/10.1109/eptc50525.2020.9315155 4. Chang, M., Lin, C., Shen, C., Wang, S. W., Chang, K. C., Chang, K., & Yeh, W.-K. (2021). The role of government policy in the building of a global semiconductor industry. Nature Electronics, 4(4), 230. https://doi.org/10.1038/s41928-021-00575-z 5. Chang, P. L., Lung, S. S.-C., & Hsu, C. W. (1999). The evaluating model for the technology needs of Taiwan high-tech industries. International Journal of Technology Management, 18, 133. https://doi.org/10.1504/ijtm.1999.002758 6. Chang, Y.-H. (2023). Advanced Semiconductor Packaging: Trends and Growth Drivers. https://www.idtechex.com/en/research-article/advanced-semiconductor-packaging-trends-and-growth-drivers/29313 7. Chen, C.-F., & Sewell, G. (1996). Strategies for technological development in South Korea and Taiwan: the case of semiconductors. Research Policy, 25(5), 759. https://doi.org/10.1016/0048-7333(95)00861-6 8. Choi, J. (2023). Intense Battle Over US$90 Billion ‘Semiconductor Packaging’ Market. https://www.businesskorea.co.kr/news/articleView.html?idxno=201165 9. Germann, J., Rolf, S., Baines, J., & Starrs, S. (2024). A Chip War Made in Germany? US Techno‐Dependencies, China Chokepoints, and the German Semiconductor Industry. Politics and Governance, 12. https://doi.org/10.17645/pag.8265 10. Gottscho, R. A., Levine, E. V., Liu, T. K., McIntyre, P. C., Mitra, S., Murmann, B., Rabaey, J. M., Salahuddin, S., Shih, W. C., & Wong, H. ‐S. P. (2022). Innovating at Speed and at Scale: A Next Generation Infrastructure for Accelerating Semiconductor Technologies. arXiv (Cornell University). https://doi.org/10.48550/arxiv.2204.02216 11. Hsieh, Y., Lin, N., & Chiu, H.-C. (2002). Virtual factory and relationship marketing—a case study of a Taiwan semiconductor manufacturing company. International Journal of Information Management, 22(2), 109. https://doi.org/10.1016/s0268-4012(01)00049-4 12. Hunt, W., & Zwetsloot, R. (2020). The Chipmakers: U.S. Strengths and Priorities for the High-End Semiconductor Workforce. https://doi.org/10.51593/20190035 13. Inoshita, K. (2024). Global Semiconductor Strategies: A Comparative Analysis of the USA, Japan, China and The EU. https://www.linkedin.com/pulse/global-semiconductor-strategies-comparative-analysis-usa-ken-inoshita-8aeqc 14. Keller, W. W., & Pauly, L. W. (2000). Crisis and Adaptation in East Asian Innovation Systems: The Case of the Semiconductor Industry in Taiwan and South Korea. Business and Politics, 2(3), 327. https://doi.org/10.2202/1469-3569.1014 15. Lai, H. C., Chang, S.-C., & Shyu, J. Z. (2004). The innovation policy priorities in industry evolution: the case of Taiwan’s semiconductor industry. International Journal of Foresight and Innovation Policy, 1, 106. https://doi.org/10.1504/ijfip.2004.004617 16. Lin, G. T. R., Yu, H. C., Hsieh, A. Y. L., & Chou, J. C. (2009). Technology management and strategy composition: innovation of IC foundry. Journal of Intelligent Manufacturing, 21(6), 885. https://doi.org/10.1007/s10845-009-0265-y 17. Naumann, F., & Schnitzer, M. (2024). Rationales for Industrial Policy in the Semiconductor Industry. Intereconomics, 59(5). https://doi.org/10.2478/ie-2024-0053 18. Nenni, D. (2023). TSMC 2023 North America Technology Symposium Overview Part 3. https://semiwiki.com/semiconductor-manufacturers/tsmc/328139-tsmc-2023-north-america-technology-symposium-overview-part-3/ 19. Paché, G. (2024). Do Tensions in the South China Sea Herald the Collapse of Global Supply Chains? International Journal of Managing Value and Supply Chains, 15(3). https://doi.org/10.5121/ijmvsc.2024.15301 20. Tung, A. (2001). Taiwan’s Semiconductor Industry: What the State Did and Did Not. Review of Development Economics, 5(2), 266. https://doi.org/10.1111/1467-9361.00123 21. Tyson, M. (2023). Veteran TSMC R&D Exec Joins Samsung’s Chip Packaging Team. https://www.tomshardware.com/news/tsmc-samsung-exec-rd 22. Wang, C., Peng, Y.-C., Hsueh, M.-H., & Wang, Y.-H. (2020). The Selection of Strategic Alliance in IC Packaging and Testing Industry with DEA Resampling Comparative Evaluation. Applied Sciences, 11(1). https://doi.org/10.3390/app11010204 23. Wang, C.-H., & Lin, H.-C. (2021). Competitive substitution and technological diffusion for semiconductor foundry firms. Advanced Engineering Informatics, 48. https://doi.org/10.1016/j.aei.2021.101254 24. Wang, C.-T., & Chiu, C.-S. (2013). Competitive strategies for Taiwan’s semiconductor industry in a new world economy. Technology in Society, 36, 60. https://doi.org/10.1016/j.techsoc.2013.12.002 25. Yang, C., Lin, K.-P., & Chen, K. (2019). Confidence Interval Based Fuzzy Evaluation Model for an Integrated-Circuit Packaging Molding Process. Applied Sciences, 9(13), 2623. https://doi.org/10.3390/app9132623 26. Zhang, X., & Liu, W. (2009). The Study of the Use of FDI to Enhance the Product Competitiveness of Integrated Circuits and Micro-electronic Components. International Business Research, 1(3). https://doi.org/10.5539/ibr.v1n3p48 27. 李雯琪. (2022). 半導體晶圓代工廠商與封測廠商競合關係之探討─以台積電與日月光為例. https://hdl.handle.net/11296/t26tp8 28. Yole Intelligence《Advanced Packaging Market Monitor Q4 2024》https://www.yolegroup.com/product/quarterly-monitor/advanced-packaging-market-monitor-q4-2024/
描述 碩士
國立政治大學
經營管理碩士學程(EMBA)
112932038
資料來源 http://thesis.lib.nccu.edu.tw/record/#G0112932038
資料類型 thesis
dc.contributor.advisor 黃家齊zh_TW
dc.contributor.author (Authors) 吳明倫zh_TW
dc.contributor.author (Authors) Wu, Ming-Lunen_US
dc.creator (作者) 吳明倫zh_TW
dc.creator (作者) Wu, Ming-Lunen_US
dc.date (日期) 2025en_US
dc.date.accessioned 4-Aug-2025 13:00:46 (UTC+8)-
dc.date.available 4-Aug-2025 13:00:46 (UTC+8)-
dc.date.issued (上傳時間) 4-Aug-2025 13:00:46 (UTC+8)-
dc.identifier (Other Identifiers) G0112932038en_US
dc.identifier.uri (URI) https://nccur.lib.nccu.edu.tw/handle/140.119/158322-
dc.description (描述) 碩士zh_TW
dc.description (描述) 國立政治大學zh_TW
dc.description (描述) 經營管理碩士學程(EMBA)zh_TW
dc.description (描述) 112932038zh_TW
dc.description.abstract (摘要) 本研究旨在深入探討台灣與韓國在半導體先進封裝領域的銷售與技術策略。在全球半導體產業競爭日益激烈的背景下，先進封裝技術已成為提升晶片效能、降低功耗、縮小尺寸的關鍵。本研究針對台積電、日月光、三星、Amkor等領先企業進行分析，探討其銷售模式、市場策略、技術發展與全球佈局上的差異，進一步比較台韓企業在客戶群、定價策略與供應鏈管理的異同。 研究發現，台灣企業以專業代工與供應鏈整合能力見長，特別在CoWoS與SoIC平台已具備成熟商業模式；韓國企業則仰賴IDM垂直整合與政府政策支持，強化記憶體與系統級整合的競爭力。在高效能運算與AI應用領域，台積電憑藉先進封裝能力居於領先地位，而三星尚處於技術追趕階段。日月光與Amkor分別為台韓封測生態的代表，展現不同的市場定位與服務強項。 本研究也指出，先進封裝發展促使晶圓代工與封測廠由傳統分工轉向策略競合，尤其以台積電與Amkor於美國亞利桑那州的合作為代表案例，反映產業結構與商業模式正在調整。此外，台韓企業未來的全球市場定位，將取決於其是否能靈活運用技術創新、客戶整合、在地化生產與國際策略聯盟等多元策略。 研究採用次級資料分析方法，蒐集市場調查報告、產業分析、企業財報等資訊，並輔以作者所屬公司與台積電、日月光、三星、Amkor等企業於先進封裝領域的實務合作經驗，以掌握產業第一手觀察，補強公開資料的不足。 研究範圍涵蓋Fan-out、2.5D、3D IC等先進封裝技術，並從銷售策略與技術策略兩大主軸切入，結合SWOT分析架構，全面評估台韓在先進封裝領域的優勢與挑戰。最終，提出企業應強化研發投入、供應鏈彈性、人才培育與跨國合作的建議；政府層面運用鑽石模型（Diamond Model）切入，應推動基礎設施建設、政策補助與智慧財產保護，以厚植競爭韌性並鞏固國際地位。 本研究不僅為學術界提供一套深入理解台韓半導體封裝策略的研究基礎，亦為企業與政策制定者提供實務參考，以應對全球半導體供應鏈重組與技術演進所帶來的多重挑戰。zh_TW
dc.description.abstract (摘要) This study aims to explore the sales and technology strategies of Taiwan and South Korea in the field of advanced semiconductor packaging. Amid intensifying global semiconductor competition, advanced packaging technologies have become critical for enhancing chip performance, reducing power consumption, and minimizing device size. This research analyzes leading companies including TSMC, ASE, Samsung, and Amkor, examining differences in their sales models, market strategies, technology development approaches, and global deployment. It also compares the two countries’ approaches in customer targeting, pricing, and supply chain management. Findings indicate that Taiwanese companies excel in specialized foundry services and supply chain integration, with mature commercialization platforms such as CoWoS and SoIC. In contrast, Korean firms leverage IDM vertical integration and strong government policy support to strengthen their competitiveness in memory and system-level integration. In high-performance computing and AI applications, TSMC leads with advanced packaging capabilities, while Samsung remains in a catch-up phase. ASE and Amkor represent the respective packaging ecosystems in Taiwan and Korea, each with differentiated market positioning and service strengths. The study also observes a growing trend of competition-collaboration (coopetition) between foundries and OSATs in advanced packaging, as seen in the strategic partnership between TSMC and Amkor in Arizona, USA. The evolution from traditional division of labor to collaborative innovation reflects a shift in industry structure and business models. Furthermore, future global market positioning of Taiwan and Korea will depend on their ability to flexibly leverage strategies such as technological innovation, customer integration, localization, and international alliances. A secondary data analysis approach was adopted, utilizing market research reports, industry analyses, and financial statements, complemented by the author’s firsthand experience from business collaborations with TSMC, ASE, Samsung, and Amkor in advanced packaging. This combination provided deeper industry insights beyond what is available from public information. The research focuses on key advanced packaging technologies including fan-out, 2.5D, and 3D IC. It evaluates the strengths and challenges of Taiwanese and Korean enterprises using SWOT analysis across two strategic dimensions: sales and technology. The study concludes with comprehensive recommendations—companies should enhance R&D investments, improve supply chain resilience, nurture talent, and foster cross-border collaboration; while governments should strengthen infrastructure, provide financial incentives, and reinforce intellectual property protection to bolster global competitiveness. This study contributes to academic understanding of the strategic development in Taiwan and South Korea’s advanced packaging sectors and offers practical insights for businesses and policymakers to respond to emerging challenges in the evolving global semiconductor landscape.en_US
dc.description.tableofcontents 第一章 緒論 1 第一節 研究背景與動機 1 第二節 研究目的與問題 2 第三節 技術名詞解釋 4 第二章 產業回顧-台韓半導體先進封裝產業現況 7 第一節 半導體先進封裝技術概述 7 第二節 台灣產業現況 10 第三節 韓國產業現況 11 第三章 研究方法-台韓半導體主要市場架構 13 第一節 研究方法 13 第二節 次級資料分析 14 第三節 研究架構與分析框架設計 15 第四章 研究分析-台韓銷售與技術策略比較與未來發展策略建議 18 第一節 銷售模式與市場策略 18 第二節 技術發展及合作模式 23 第三節 全球市場趨勢與競合變化 33 第四節 台韓企業的機會與挑戰 36 第五節 對企業與政府的策略建議 44 第五章 結論與建議 48 第一節 研究結論與貢獻 48 第二節 研究限制與未來方向 55 參考文獻 58zh_TW
dc.format.extent 2023330 bytes-
dc.format.mimetype application/pdf-
dc.source.uri (資料來源) http://thesis.lib.nccu.edu.tw/record/#G0112932038en_US
dc.subject (關鍵詞) 半導體zh_TW
dc.subject (關鍵詞) 先進封裝zh_TW
dc.subject (關鍵詞) 銷售策略zh_TW
dc.subject (關鍵詞) 技術策略zh_TW
dc.subject (關鍵詞) 台韓比較zh_TW
dc.subject (關鍵詞) Semiconductoren_US
dc.subject (關鍵詞) Advanced Packagingen_US
dc.subject (關鍵詞) Sales Strategyen_US
dc.subject (關鍵詞) Technology Strategyen_US
dc.subject (關鍵詞) Taiwan–Korea Comparisonen_US
dc.title (題名) 台韓半導體先進封裝之銷售與技術策略規劃研究zh_TW
dc.title (題名) The Sales and Technology Strategy of Advanced Semiconductor Packaging in Taiwan and South Koreaen_US
dc.type (資料類型) thesisen_US
dc.relation.reference (參考文獻) 1. Bish, J., Stewart, D., Ramachandran, K., Lee, P., & Beerlage, S. (2022). A new dawn for European chips. https://www2.deloitte.com/us/en/insights/industry/technology/semiconductor-chip-shortage-supply-chain.html 2. Byun, B.-M., & Ahn, B. (1989). Growth of the Korean semiconductor industry and its competitive strategy in the world market. Technovation, 9(8), 635. https://doi.org/10.1016/0166-4972(89)90004-7 3. Chai, T., Ho, D., Chong, S., Hsiao, H., Soh, S., Lim, S., PS, S. L., Wai, E. L. C., BL, L., WW, S., Gk, L., TS, P., Lim, K. C. S., SH, S. L., & Yl, Y. (2020). Fan-Out Wafer Level Packaging Development Line. 440. https://doi.org/10.1109/eptc50525.2020.9315155 4. Chang, M., Lin, C., Shen, C., Wang, S. W., Chang, K. C., Chang, K., & Yeh, W.-K. (2021). The role of government policy in the building of a global semiconductor industry. Nature Electronics, 4(4), 230. https://doi.org/10.1038/s41928-021-00575-z 5. Chang, P. L., Lung, S. S.-C., & Hsu, C. W. (1999). The evaluating model for the technology needs of Taiwan high-tech industries. International Journal of Technology Management, 18, 133. https://doi.org/10.1504/ijtm.1999.002758 6. Chang, Y.-H. (2023). Advanced Semiconductor Packaging: Trends and Growth Drivers. https://www.idtechex.com/en/research-article/advanced-semiconductor-packaging-trends-and-growth-drivers/29313 7. Chen, C.-F., & Sewell, G. (1996). Strategies for technological development in South Korea and Taiwan: the case of semiconductors. Research Policy, 25(5), 759. https://doi.org/10.1016/0048-7333(95)00861-6 8. Choi, J. (2023). Intense Battle Over US$90 Billion ‘Semiconductor Packaging’ Market. https://www.businesskorea.co.kr/news/articleView.html?idxno=201165 9. Germann, J., Rolf, S., Baines, J., & Starrs, S. (2024). A Chip War Made in Germany? US Techno‐Dependencies, China Chokepoints, and the German Semiconductor Industry. Politics and Governance, 12. https://doi.org/10.17645/pag.8265 10. Gottscho, R. 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Yole Intelligence《Advanced Packaging Market Monitor Q4 2024》https://www.yolegroup.com/product/quarterly-monitor/advanced-packaging-market-monitor-q4-2024/zh_TW