dc.contributor.advisor | 黃秉德 | zh_TW |
dc.contributor.author (Authors) | 邵曉峰 | zh_TW |
dc.contributor.author (Authors) | Shao,Justin | en_US |
dc.creator (作者) | 邵曉峰 | zh_TW |
dc.creator (作者) | Shao,Justin | en_US |
dc.date (日期) | 2003 | en_US |
dc.date.accessioned | 18-Sep-2009 13:28:32 (UTC+8) | - |
dc.date.available | 18-Sep-2009 13:28:32 (UTC+8) | - |
dc.date.issued (上傳時間) | 18-Sep-2009 13:28:32 (UTC+8) | - |
dc.identifier (Other Identifiers) | G0091355047 | en_US |
dc.identifier.uri (URI) | https://nccur.lib.nccu.edu.tw/handle/140.119/34977 | - |
dc.description (描述) | 碩士 | zh_TW |
dc.description (描述) | 國立政治大學 | zh_TW |
dc.description (描述) | 企業管理研究所 | zh_TW |
dc.description (描述) | 91355047 | zh_TW |
dc.description (描述) | 92 | zh_TW |
dc.description.abstract (摘要) | 知識管理的發展,就目前而言,理論部分已經算是相當的完備,有許多外國與本國學者都注意到知識管理的重要性,並且對影響知識管理的因素、知識管理的運作等都有相當程度的研究。但是在企業的真正落實上,卻還是有一段差距,雖然目前也越來越多企業家瞭解到知識經濟時代的來臨與知識管理的重要性,但其在落實上,卻還是不易找到一個真正的著力點。以半導體產業做為例子,因為其價值鍊上各位置專業分工的不同,導致各專業分工都必須具有自己本身的核心能力,因此為了培養與加強本身的核心能力,知識的累積就顯的重要,是故,在知識分享的機制方面,就必須根據不同的核心能力所需不同的之事類型來作調整。簡單的以知識類型與核心能力作一個分類,前端的IC設計廠商所必須具備的是晶片設計的能力,而這樣的能力主要多以員工本身為主要的存在容器,也就是所謂的隱性知識,並且因為通稱的經驗也佔有相當大的影響力,是故其顯性化就較不容易,因此其知識分享機制就必須以隱性知識為中心。在中段的IC製造廠商本身業務算是價值鍊中最複雜的,因為他必須負責部分整合的工作,也就是說,除了自己本身的製造生產能力外,也必須有部分設計能力,和本身也必須投入資源在製程的研發上,進行高階的製程研發以求符合IC設計客戶的需求,因此其需要的知識類型不只有顯性、也有隱性。後段的IC封測業務相較於IC製造就顯的較為專門化,主要在從事IC製造的產品作封裝與測試工作,因此整體來能來說,標準化、大量化、或品質控管能力等都是其核心能力,是故其需要的知識類型主要在於顯性知識的轉化。當然,除了核心能力外,組織規模、領導者、工作內容、產業的獨特生態與個別特殊的策略性思維,都將是影響知識分享機制的因素。 | zh_TW |
dc.description.abstract (摘要) | 『Knowledge Management』 is getting more and more important now. And lots of scholars had already realize the importance, then paid large attention doing research about the KM.But in practicing, many industries still did not good at the KM. They understand the value of the KM, but they cannot find a good way to make it perfect.Take IC industry for instance. We all know that each step in the value chain has its own business, including design, foundry, and package. As a result, they should own different core competence to fit their business. And creating core competence should depend on knowledge accumulating. So they should need different knowledge types.IC design industries should have tacit knowledge, and package industries should have explicit knowledge. The foundry, are more complex, they should have both.Besides of the core competence, the scale, the CEO, the business, and the policy all will affect the knowledge sharing. | en_US |
dc.description.tableofcontents | 第一章 導論 …………………………………………………………10第一節 研究動機 ……………………………………………………………10第二節 研究目的 ……………………………………………………………13第三節 研究問題……………………………………………………………14第二章 文獻探討 ……………………………………………………16第一節 價值鍊的定義 ………………………………………………………16第二節 台灣半導體產業價值鍊運作現況 …………………………………17第三節 知識定義與分類 ……………………………………………………19第三節 知識分享意義 ………………………………………………………23第四節 影響知識分享因素 …………………………………………………25第五節 知識分享機制 ………………………………………………………29第六節 核心能力的意義與內涵 ……………………………………………37第七節 核心能力的類別 ……………………………………………………41第八節 核心能力的辨識 ……………………………………………………41第九節 以價值鍊觀點從事核心能力的辨識 ………………………………46第十節 核心能力與知識分享 ………………………………………………48第三章 研究方法 ……………………………………………………51第一節 研究架構與假設 ……………………………………………………51第二節 研究變數與變數說明 ………………………………………………52第三節 訪談對象選擇 ………………………………………………………59第四節 訪談問題設計 ………………………………………………………61第五節 研究步驟與規劃 ……………………………………………………62第六節 研究流程 ……………………………………………………………64第四章 訪談個案基本資料分析 ……………………………………65第一節 IC設計廠商基本資料 ……………………………………………65第二節 IC製造廠商基本資料 ……………………………………………67第三節 封測廠商基本資料 ……………………………………………70第五章 訪談結果整理分析 …………………………………………73第一節 半導體產業價值鍊核心能力分析 ………………………………73第二節 知識分享機制分析 ………………………………………………77第三節 以核心能力的觀點檢視知識分享機制差異 ……………………82第四節 其他影響知識分享機制因素 ……………………………………84第六章 研究結論與建議 ……………………………………………89第一節 研究結論 ……………………………………………………………89第二節 本研究建議 …………………………………………………………94第三節 研究限制 ……………………………………………………………95參考文獻 ………………………………………………………………98附錄一 訪談問卷附錄二 訪談整理 | zh_TW |
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dc.language.iso | en_US | - |
dc.source.uri (資料來源) | http://thesis.lib.nccu.edu.tw/record/#G0091355047 | en_US |
dc.subject (關鍵詞) | 半導體 | zh_TW |
dc.subject (關鍵詞) | 知識分享 | zh_TW |
dc.subject (關鍵詞) | 核心能力 | zh_TW |
dc.subject (關鍵詞) | 價值鍊 | zh_TW |
dc.subject (關鍵詞) | Semi-conductor | en_US |
dc.subject (關鍵詞) | Knowledge-sharing | en_US |
dc.subject (關鍵詞) | Core-compatence | en_US |
dc.subject (關鍵詞) | Value-chain | en_US |
dc.title (題名) | 半導體廠商價值鍊位置、核心能力與知識分享機制關係之研究 | zh_TW |
dc.type (資料類型) | thesis | en |
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