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題名 探討調適性學習行為-以半導體工程師排除晶圓缺陷工作實務為例
Adaptive learning in semiconductor industry
作者 陳維中
貢獻者 蕭瑞麟
Xiao, Ruey Lin
陳維中
關鍵詞 情境學習
調適性學習
situated learning
adaptive learning
日期 2010
上傳時間 29-Sep-2011 16:41:13 (UTC+8)
摘要 我國專業晶圓代工產業已是全球半導體產業鏈中不可或缺一環，此創新之商業模式不但帶動了全球半導體產業鏈的重整，更為我國半導體產業奠定了雄厚的基礎。但是無法快速回應晶圓缺陷問題與縮短工程師培訓時間，卻仍是台灣半導體產業發展近四十幾年來的瓶頸。此問題的延誤不傴使晶圓廠耗損巨額的成本，更承擔喪失國際客戶訂單的風險。因此，如何使半導體工程師提升工作效率，與如何有效培養新進工程師，如今已成為半導體業界刻不容緩之議題。
     在知識經濟時代中，為企業打造適宜之知識管理模式是產、官、學界所致力的目標。但多數的研究以資訊科技所主導的知識管理系統為範疇，鮮少研究去探索知識工作者陎臨求解問題的困境中，是如何依循著問題情境，如何在其中摸索，進而發展出解決方案的詳細過程。有鑑於此，本研究選擇以詮釋型個案研究方法，深入訪察半導體工程師工作實務，藉此瞭解工程師於維修情境中排除晶圓缺陷的樣貌。
     經由探討排除晶圓缺陷的工作實務中發現，工程師具備了四禑與「情境」調適性學習(adaptive learning)((Tyre and von Hippel,1997)的歷程：第一、工程師必頇在問題情境中，辨認隱藏於情境當中之線索，並賦與線索意義而展開偵察行動。第二、工程師在偵察過程中，頇不斷地依情境調整收集資料技巧，挖掘出更多或更深層的資訊。第三、工程師適當的工具與資源，有效率地萃取更多的資訊。第四、工程師彼此之間依情境發展出最適行為模式，得以順利整合跨部門執行偵察行動。
     本研究著重於解析工程師在問題情境中，不斷學習與調適之詳細過程，並指出調適性學習如何在排除晶圓異常工作中扮演重要的角色。最後，針對調適性學習行為提出具體的理論與實務意涵，以供組織未來進行人員培訓與知識管理之參考。
第一章 緒論.................................................................................................................. 1
     第一節、研究背景與動機.................................................................................... 1
     第二節、研究目的與研究問題............................................................................ 3
     第三節、論文章節安排........................................................................................ 7
     第二章 文獻探討.......................................................................................................... 8
     第一節、情境學習(situated learning) .................................................................. 9
     一、不具「絕對性」的知識........................................................................ 9
     二、不具「可攜性」的知識........................................................................ 9
     第二節、在實踐中學習(learning in practices) .................................................. 10
     第三節、在社會互動中學習(learning in social interactions) ............................ 13
     第四節、在實體情境中學習(learning in physical contexts) ............................. 14
     第五節、調適性學習(adaptive learning) ........................................................... 15
     第三章 研究方法........................................................................................................ 18
     第一節、個案選擇.............................................................................................. 19
     第二節、資料搜集.............................................................................................. 23
     一、實地參與觀察(Participant Observation) ............................................. 23
     二、訪談(Interviews) .................................................................................. 24
     三、資料文件(Documents) ......................................................................... 25
     第三節、資料分析.............................................................................................. 26
     第四章 研究發現........................................................................................................ 29
     第一節、晶圓缺陷排除工作實務...................................................................... 31
     第二節、個案一：晶圓編號中的玄機.............................................................. 35
     一、抽絲剝繭.............................................................................................. 36
     二、擴大的災情.......................................................................................... 37
     三、击起的軟墊與3的倍數...................................................................... 39
     四、 調適性學習行為描述.................................................................. 42
     第三節、晶圓缺陷排除個案二：刮痕背後的真相.......................................... 52
     一、兩道直線型刮痕.................................................................................. 52
     二、來自機器手臂的訊息.......................................................................... 54
     三、偵察新契機.......................................................................................... 56
     四、人為的疏失.......................................................................................... 58
     五、調適性學習行為描述.......................................................................... 58
     第四節、晶圓缺陷排除個案三：晶圓切片手術.............................................. 69
     一、龐大的污染物...................................................................................... 69
     二、晶圓檢驗室.......................................................................................... 71
     三、蝕刻部門的質疑.................................................................................. 73
     iii
     四、污染物成份分析.................................................................................. 76
     五、老舊的晶圓匣...................................................................................... 77
     六、調適性學習行為描述.......................................................................... 78
     第五節、調適性學習行為模式分析.................................................................. 86
     一、調適性學習行為模式分析.................................................................. 86
     第五章 討論................................................................................................................ 91
     第一節、理論意涵.............................................................................................. 91
     第二節、實務意涵.............................................................................................. 96
     第六章 結論與建議.................................................................................................... 98
     第一節、研究結論.............................................................................................. 98
     第二節、研究限制.............................................................................................. 99
     第三節、研究建議.............................................................................................. 99
     參考文獻.................................................................................................................... 100
     一、英文部分.................................................................................................... 100
     圖目錄
     圖3-1 我國半導體專業分工產業鏈 ......................................................................... 19
     圖4-1軟墊位置示意圖 .............................................................................................. 39
     圖4-2 晶圓損傷示意圖 ............................................................................................. 52
     表目錄
     表3-1 我國半導體產業產值 ..................................................................................... 20
     表3-2 訪談人數表 ..................................................................................................... 25
     表4-1、調適性學習表格（個案一） ....................................................................... 44
     表4-1(續)、調適性學習表格（個案一）................................................................. 45
     表4-1(續)、調適性學習表格（個案一）................................................................. 46
     表4-1(續)、調適性學習表格（個案一）................................................................. 47
     表4-2 調適性學習圖表（個案二） ......................................................................... 59
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 60
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 61
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 62
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 63
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 64
     表4-3 調適性學習圖表（個案三） ......................................................................... 79
     表4-3（續） 調適性學習圖表（個案三） ............................................................. 80
     表4-3（續） 調適性學習圖表（個案三） ............................................................. 81
     iv
     表4-5 學習如何將既有知識運用於情境之中 ......................................................... 87
     表4-6 學習如何在情境中持續學習 ......................................................................... 88
     表4-7 學習如何在不同情境中相輔相成 ................................................................. 90
     表5-1 調適性學習比較 ............................................................................................. 94
參考文獻 一、英文部分
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2. Argyris, C. and D. Schon (1978), Organizational Learning, Reading, MA: Addison Wesley.
3. Argyris, C. and D. Schon (1978), Organizational Learning, Reading, MA: Addison Wesley.
4. Barley, S. R. 1996. Technicians in the workplace: Ethnographic evidence for bringing work into organization studies. Administrative Science Quarterly, 41(3): 404-441.
5. Boland, R. J., & Tenkasi, R. V. 1995. Perspective making and perspective taking in communities of knowledge. Organization Science, 6(4): 350-372.
6. Bordieu, P. (1997), Outline of a Theory of Practice, New York: Cambridge University Press.
7. Brown, J. S. and P. Duguid (1991), “Organizational Learning and Communities-of-Practice: Toward a Unified View of Working, Learning and Coordination in Distributed Decision-Making Contexts,” Organization Science, 2, 1, 40-57.
8. Brown, J. S., Collins, A., & Duguid, P. (1988). Situated cognition and the culture of learning. (ERIC Document Reproduction Service No. ED 342 357.)
9. Ching, C.,C. W. Holsapple and A. B. Whinston (1992), “Reputation, Learning and Coordination in Distributed Decision-Making Contexts,” Organization Science.
10. Cicourel, A. (1990), “The Integration of Distributed Knowledge in Collaborative
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Medical Diagnosis,” in J. Galegher, R. Kraut and C. Egido (Eds.), Intellectual Teamwork : Social and Technological Foundations of Cooperative Work, Hillsdale, NJ: Lawrence Erlbaum Associates.
11. Collins, A.(1993). Design issues for learning environments. (ERIC Document Reproduction Service No. ED 357 733.)
12. Cyert, R. M. and J. March (1963), A Behavioral Theory of the Firm, Englewood Cliffs, NJ: Prentice-Hall.
13. Davenport, T. H., & Prusak, L. 1997. Working knowledge: how organizations
14. Dewey, J. (1938), Logic: The Theory of Inquiry, New York: Holt and Company.
distributed organizing. Organization Science, 13(3): 249-273.
15. Drucker, P.F. (1993),“Post-Capitalist Society,” New York: Harper Collins, p.25-30.
16. Giddens, A. (1984), The Constitution of Society, Berkeley, CA: University of California Press.
17. Hutchins, E. (1990), “The Technology of Team Navigation,” in J. Galegher, R. Kraut and C. Egido (Eds.), Intellectual Teamwork: Social and Technological Foundations of Cooperative Work, Hillsdale, NJ: Lawrence Erlbaum Associates.
18. Knorr-Cetina, K. D. (1981), The Manufacture of Knowledge: An Essay on the Constructivist and Contextual Nature of Science, Oxford, UK: Pergamon.
19. Latour, B. and S. Woolgar (1979), Laboratory Life: The Social Construction of Scientific Facts, Beverly Hills, CA: Sage Publications.
20. Lave, J. & Wenger, E. (1991). Situated learning: Legitimate peripheral participation. Cambridge University.
21. Lave, J. (1988), Cognition in Practice: Mind, Mathematics, and Culture in Everyday life, New York: Cambridge University Press.
22. Levitt, B. and J. March (1988), “ Organization Learning,” Annual Review of
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Sociology, 14, 31-40.
manage what they know, Boston: Harvard Business School Press.
23. March, J. and J. Olsen (1975), “The Uncertainty of the Past: Organization Learning Under Ambiguity,” European Journal of Political Research, 3, 147-171,and H. Simon (1958), Organizations, New York: John Wiley.
24. March, J. and J. Olsen (1975), “The Uncertainty of the Past: Organizational Learning Under Ambiguity,” European Journal of Political Research, 3, 147-171
25. Nonaka, I. (1994), “A Dynamic Theory of Organizational Knowledge Creation,” Organization Science, 5, 1, 14-37.
organizations. Organization Science, 8(1): 71-83.
26. Orlikowski, W. J. 2002. Knowing in practice: enacting a collective capability in
27. Orr, J. (1990), “A Dynamic Theory of Organizational Knowledge Creation,” Organization Science, 5, 1, 14-37.
28. Polanyi, M. (1958), Personal Knowledge: Towards a Post-Critical Philosophy, Chicago, IL: Chicago University Press.
29. Ryle, G. (1949), The Concept of Mind, London, UK: Hutchinson House.
30. Schultze, U. (2000). A confessional account of ethnography about knowledge work. MIS Quarterly, 24(1): 3-41.
31. Suchman, L. (1987), Plans and situated Actions: The Problem of Human Machine Communication, New York: Cambridge University Press.
32. Tyre, M. J., & von Hippel, E. 1997. The situated nature of adaptive learning in Organizations
33. Weick, K. E. (1979), The Social Psychology of Organizing, 2d ed., New York: Random House.
34. Weick, K. E. and K. H. Roberts (1993), “Collective Mind in Organizations:
103
Heedful Interrelating on Flight Decks,” Administrative Science Quarterly, 38, 357-381.
描述 碩士
國立政治大學
科技管理研究所
96359020
99
資料來源 http://thesis.lib.nccu.edu.tw/record/#G0096359020
資料類型 thesis
dc.contributor.advisor 蕭瑞麟zh_TW
dc.contributor.advisor Xiao, Ruey Linen_US
dc.contributor.author (Authors) 陳維中zh_TW
dc.creator (作者) 陳維中zh_TW
dc.date (日期) 2010en_US
dc.date.accessioned 29-Sep-2011 16:41:13 (UTC+8)-
dc.date.available 29-Sep-2011 16:41:13 (UTC+8)-
dc.date.issued (上傳時間) 29-Sep-2011 16:41:13 (UTC+8)-
dc.identifier (Other Identifiers) G0096359020en_US
dc.identifier.uri (URI) http://nccur.lib.nccu.edu.tw/handle/140.119/50799-
dc.description (描述) 碩士zh_TW
dc.description (描述) 國立政治大學zh_TW
dc.description (描述) 科技管理研究所zh_TW
dc.description (描述) 96359020zh_TW
dc.description (描述) 99zh_TW
dc.description.abstract (摘要) 我國專業晶圓代工產業已是全球半導體產業鏈中不可或缺一環，此創新之商業模式不但帶動了全球半導體產業鏈的重整，更為我國半導體產業奠定了雄厚的基礎。但是無法快速回應晶圓缺陷問題與縮短工程師培訓時間，卻仍是台灣半導體產業發展近四十幾年來的瓶頸。此問題的延誤不傴使晶圓廠耗損巨額的成本，更承擔喪失國際客戶訂單的風險。因此，如何使半導體工程師提升工作效率，與如何有效培養新進工程師，如今已成為半導體業界刻不容緩之議題。
     在知識經濟時代中，為企業打造適宜之知識管理模式是產、官、學界所致力的目標。但多數的研究以資訊科技所主導的知識管理系統為範疇，鮮少研究去探索知識工作者陎臨求解問題的困境中，是如何依循著問題情境，如何在其中摸索，進而發展出解決方案的詳細過程。有鑑於此，本研究選擇以詮釋型個案研究方法，深入訪察半導體工程師工作實務，藉此瞭解工程師於維修情境中排除晶圓缺陷的樣貌。
     經由探討排除晶圓缺陷的工作實務中發現，工程師具備了四禑與「情境」調適性學習(adaptive learning)((Tyre and von Hippel,1997)的歷程：第一、工程師必頇在問題情境中，辨認隱藏於情境當中之線索，並賦與線索意義而展開偵察行動。第二、工程師在偵察過程中，頇不斷地依情境調整收集資料技巧，挖掘出更多或更深層的資訊。第三、工程師適當的工具與資源，有效率地萃取更多的資訊。第四、工程師彼此之間依情境發展出最適行為模式，得以順利整合跨部門執行偵察行動。
     本研究著重於解析工程師在問題情境中，不斷學習與調適之詳細過程，並指出調適性學習如何在排除晶圓異常工作中扮演重要的角色。最後，針對調適性學習行為提出具體的理論與實務意涵，以供組織未來進行人員培訓與知識管理之參考。		zh_TW
dc.description.abstract (摘要) 第一章 緒論.................................................................................................................. 1
     第一節、研究背景與動機.................................................................................... 1
     第二節、研究目的與研究問題............................................................................ 3
     第三節、論文章節安排........................................................................................ 7
     第二章 文獻探討.......................................................................................................... 8
     第一節、情境學習(situated learning) .................................................................. 9
     一、不具「絕對性」的知識........................................................................ 9
     二、不具「可攜性」的知識........................................................................ 9
     第二節、在實踐中學習(learning in practices) .................................................. 10
     第三節、在社會互動中學習(learning in social interactions) ............................ 13
     第四節、在實體情境中學習(learning in physical contexts) ............................. 14
     第五節、調適性學習(adaptive learning) ........................................................... 15
     第三章 研究方法........................................................................................................ 18
     第一節、個案選擇.............................................................................................. 19
     第二節、資料搜集.............................................................................................. 23
     一、實地參與觀察(Participant Observation) ............................................. 23
     二、訪談(Interviews) .................................................................................. 24
     三、資料文件(Documents) ......................................................................... 25
     第三節、資料分析.............................................................................................. 26
     第四章 研究發現........................................................................................................ 29
     第一節、晶圓缺陷排除工作實務...................................................................... 31
     第二節、個案一：晶圓編號中的玄機.............................................................. 35
     一、抽絲剝繭.............................................................................................. 36
     二、擴大的災情.......................................................................................... 37
     三、击起的軟墊與3的倍數...................................................................... 39
     四、 調適性學習行為描述.................................................................. 42
     第三節、晶圓缺陷排除個案二：刮痕背後的真相.......................................... 52
     一、兩道直線型刮痕.................................................................................. 52
     二、來自機器手臂的訊息.......................................................................... 54
     三、偵察新契機.......................................................................................... 56
     四、人為的疏失.......................................................................................... 58
     五、調適性學習行為描述.......................................................................... 58
     第四節、晶圓缺陷排除個案三：晶圓切片手術.............................................. 69
     一、龐大的污染物...................................................................................... 69
     二、晶圓檢驗室.......................................................................................... 71
     三、蝕刻部門的質疑.................................................................................. 73
     iii
     四、污染物成份分析.................................................................................. 76
     五、老舊的晶圓匣...................................................................................... 77
     六、調適性學習行為描述.......................................................................... 78
     第五節、調適性學習行為模式分析.................................................................. 86
     一、調適性學習行為模式分析.................................................................. 86
     第五章 討論................................................................................................................ 91
     第一節、理論意涵.............................................................................................. 91
     第二節、實務意涵.............................................................................................. 96
     第六章 結論與建議.................................................................................................... 98
     第一節、研究結論.............................................................................................. 98
     第二節、研究限制.............................................................................................. 99
     第三節、研究建議.............................................................................................. 99
     參考文獻.................................................................................................................... 100
     一、英文部分.................................................................................................... 100
     圖目錄
     圖3-1 我國半導體專業分工產業鏈 ......................................................................... 19
     圖4-1軟墊位置示意圖 .............................................................................................. 39
     圖4-2 晶圓損傷示意圖 ............................................................................................. 52
     表目錄
     表3-1 我國半導體產業產值 ..................................................................................... 20
     表3-2 訪談人數表 ..................................................................................................... 25
     表4-1、調適性學習表格（個案一） ....................................................................... 44
     表4-1(續)、調適性學習表格（個案一）................................................................. 45
     表4-1(續)、調適性學習表格（個案一）................................................................. 46
     表4-1(續)、調適性學習表格（個案一）................................................................. 47
     表4-2 調適性學習圖表（個案二） ......................................................................... 59
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 60
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 61
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 62
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 63
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 64
     表4-3 調適性學習圖表（個案三） ......................................................................... 79
     表4-3（續） 調適性學習圖表（個案三） ............................................................. 80
     表4-3（續） 調適性學習圖表（個案三） ............................................................. 81
     iv
     表4-5 學習如何將既有知識運用於情境之中 ......................................................... 87
     表4-6 學習如何在情境中持續學習 ......................................................................... 88
     表4-7 學習如何在不同情境中相輔相成 ................................................................. 90
     表5-1 調適性學習比較 ............................................................................................. 94		-
dc.description.tableofcontents 第一章 緒論.................................................................................................................. 1
     第一節、研究背景與動機.................................................................................... 1
     第二節、研究目的與研究問題............................................................................ 3
     第三節、論文章節安排........................................................................................ 7
     第二章 文獻探討.......................................................................................................... 8
     第一節、情境學習(situated learning) .................................................................. 9
     一、不具「絕對性」的知識........................................................................ 9
     二、不具「可攜性」的知識........................................................................ 9
     第二節、在實踐中學習(learning in practices) .................................................. 10
     第三節、在社會互動中學習(learning in social interactions) ............................ 13
     第四節、在實體情境中學習(learning in physical contexts) ............................. 14
     第五節、調適性學習(adaptive learning) ........................................................... 15
     第三章 研究方法........................................................................................................ 18
     第一節、個案選擇.............................................................................................. 19
     第二節、資料搜集.............................................................................................. 23
     一、實地參與觀察(Participant Observation) ............................................. 23
     二、訪談(Interviews) .................................................................................. 24
     三、資料文件(Documents) ......................................................................... 25
     第三節、資料分析.............................................................................................. 26
     第四章 研究發現........................................................................................................ 29
     第一節、晶圓缺陷排除工作實務...................................................................... 31
     第二節、個案一：晶圓編號中的玄機.............................................................. 35
     一、抽絲剝繭.............................................................................................. 36
     二、擴大的災情.......................................................................................... 37
     三、击起的軟墊與3的倍數...................................................................... 39
     四、 調適性學習行為描述.................................................................. 42
     第三節、晶圓缺陷排除個案二：刮痕背後的真相.......................................... 52
     一、兩道直線型刮痕.................................................................................. 52
     二、來自機器手臂的訊息.......................................................................... 54
     三、偵察新契機.......................................................................................... 56
     四、人為的疏失.......................................................................................... 58
     五、調適性學習行為描述.......................................................................... 58
     第四節、晶圓缺陷排除個案三：晶圓切片手術.............................................. 69
     一、龐大的污染物...................................................................................... 69
     二、晶圓檢驗室.......................................................................................... 71
     三、蝕刻部門的質疑.................................................................................. 73
     iii
     四、污染物成份分析.................................................................................. 76
     五、老舊的晶圓匣...................................................................................... 77
     六、調適性學習行為描述.......................................................................... 78
     第五節、調適性學習行為模式分析.................................................................. 86
     一、調適性學習行為模式分析.................................................................. 86
     第五章 討論................................................................................................................ 91
     第一節、理論意涵.............................................................................................. 91
     第二節、實務意涵.............................................................................................. 96
     第六章 結論與建議.................................................................................................... 98
     第一節、研究結論.............................................................................................. 98
     第二節、研究限制.............................................................................................. 99
     第三節、研究建議.............................................................................................. 99
     參考文獻.................................................................................................................... 100
     一、英文部分.................................................................................................... 100
     圖目錄
     圖3-1 我國半導體專業分工產業鏈 ......................................................................... 19
     圖4-1軟墊位置示意圖 .............................................................................................. 39
     圖4-2 晶圓損傷示意圖 ............................................................................................. 52
     表目錄
     表3-1 我國半導體產業產值 ..................................................................................... 20
     表3-2 訪談人數表 ..................................................................................................... 25
     表4-1、調適性學習表格（個案一） ....................................................................... 44
     表4-1(續)、調適性學習表格（個案一）................................................................. 45
     表4-1(續)、調適性學習表格（個案一）................................................................. 46
     表4-1(續)、調適性學習表格（個案一）................................................................. 47
     表4-2 調適性學習圖表（個案二） ......................................................................... 59
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 60
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 61
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 62
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 63
     表4-2（續） 調適性學習圖表（個案二） ............................................................. 64
     表4-3 調適性學習圖表（個案三） ......................................................................... 79
     表4-3（續） 調適性學習圖表（個案三） ............................................................. 80
     表4-3（續） 調適性學習圖表（個案三） ............................................................. 81
     iv
     表4-5 學習如何將既有知識運用於情境之中 ......................................................... 87
     表4-6 學習如何在情境中持續學習 ......................................................................... 88
     表4-7 學習如何在不同情境中相輔相成 ................................................................. 90
     表5-1 調適性學習比較 ............................................................................................. 94		zh_TW
dc.language.iso en_US-
dc.source.uri (資料來源) http://thesis.lib.nccu.edu.tw/record/#G0096359020en_US
dc.subject (關鍵詞) 情境學習zh_TW
dc.subject (關鍵詞) 調適性學習zh_TW
dc.subject (關鍵詞) situated learningen_US
dc.subject (關鍵詞) adaptive learningen_US
dc.title (題名) 探討調適性學習行為-以半導體工程師排除晶圓缺陷工作實務為例zh_TW
dc.title (題名) Adaptive learning in semiconductor industryen_US
dc.type (資料類型) thesisen
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