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題名 Improvement inconsistency of the metallic film thickness of computer connectors
作者 楊素芬;林共進;洪祖全
Yang, Su-Fen;Lin,Dennis K.J.;Hung, Tzu-Chen
貢獻者 政大統計系
關鍵詞 Engineering process control;Film thickness;Transfer function
日期 2009-03
上傳時間 12-十二月-2013 18:07:59 (UTC+8)
摘要 The variation of the film thickness and associated increase in cost are vital problems to computer connector producers. However, no scientific adjustment method is currently available. Transfer function and engineering process control are proposed to adjust the production processes for improving the quality of the metallic film of the connectors and reducing the cost of production. The analyses of the confirmatory experiments from using the two proposed approaches show significant gains in quality improvement and cost reduction. Furthermore, the engineering process control approach reveals a better improvement over the transfer function approach. Thus this approach is recommended to improve the quality of the film thickness and reduce the production cost in the computer connector industry
關聯 Journal of Process Control, 19(3), 498-505
資料類型 article
DOI http://dx.doi.org/10.1016/j.jprocont.2008.05.003
dc.contributor 政大統計系en_US
dc.creator (作者) 楊素芬;林共進;洪祖全zh_TW
dc.creator (作者) Yang, Su-Fen;Lin,Dennis K.J.;Hung, Tzu-Chenen_US
dc.date (日期) 2009-03en_US
dc.date.accessioned 12-十二月-2013 18:07:59 (UTC+8)-
dc.date.available 12-十二月-2013 18:07:59 (UTC+8)-
dc.date.issued (上傳時間) 12-十二月-2013 18:07:59 (UTC+8)-
dc.identifier.uri (URI) http://nccur.lib.nccu.edu.tw/handle/140.119/62442-
dc.description.abstract (摘要) The variation of the film thickness and associated increase in cost are vital problems to computer connector producers. However, no scientific adjustment method is currently available. Transfer function and engineering process control are proposed to adjust the production processes for improving the quality of the metallic film of the connectors and reducing the cost of production. The analyses of the confirmatory experiments from using the two proposed approaches show significant gains in quality improvement and cost reduction. Furthermore, the engineering process control approach reveals a better improvement over the transfer function approach. Thus this approach is recommended to improve the quality of the film thickness and reduce the production cost in the computer connector industryen_US
dc.format.extent 190266 bytes-
dc.format.mimetype application/pdf-
dc.language.iso en_US-
dc.relation (關聯) Journal of Process Control, 19(3), 498-505en_US
dc.subject (關鍵詞) Engineering process control;Film thickness;Transfer functionen_US
dc.title (題名) Improvement inconsistency of the metallic film thickness of computer connectorsen_US
dc.type (資料類型) articleen
dc.identifier.doi (DOI) 10.1016/j.jprocont.2008.05.003-
dc.doi.uri (DOI) http://dx.doi.org/10.1016/j.jprocont.2008.05.003-